Invention Grant
- Patent Title: Multilayer structures with enhanced adhesive bonding force and articles comprising the same
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Application No.: US18003521Application Date: 2020-08-27
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Publication No.: US12251909B2Publication Date: 2025-03-18
- Inventor: Gang Wang , Lianjiang Zhao , Jingyi Xu , Xiaobing Yun , Jianping Pan , Gaobing Chen , Jianliang Zhu
- Applicant: DOW GLOBAL TECHNOLOGIES LLC , ROHM AND HAAS COMPANY
- Applicant Address: US MI Midland; US PA Collegeville
- Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS COMPANY
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS COMPANY
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agent Jacob R. Graham
- International Application: PCT/CN2020/111758 WO 20200827
- International Announcement: WO2022/041053 WO 20220303
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/03 ; B32B7/12 ; B32B27/32 ; B32B37/12

Abstract:
Provided are multilayer structures and articles comprising same. The multilayer structure comprises: a biaxially-oriented polyethylene film comprising a skin layer with a matte surface and a core, the core comprising one or more core layers; a sealant film; and an adhesive adhering the sealant film to the matte surface of the skin layer of the biaxially-oriented polyethylene film. The multilayer structure can exhibit an enhanced adhesive bonding force in comparison to other multilayer structures.
Public/Granted literature
- US20230241871A1 MULTILAYER STRUCTURES WITH ENHANCED ADHESIVE BONDING FORCE AND ARTICLES COMPRISING THE SAME Public/Granted day:2023-08-03
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