Invention Grant
- Patent Title: Physical property measurement method, physical property measurement device, and probe
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Application No.: US18051012Application Date: 2022-10-31
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Publication No.: US12253449B2Publication Date: 2025-03-18
- Inventor: Tadashi Kajiya , Daisuke Sawai , Koji Miyata , Hiroyuki Noda
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2020-081131 20200501
- Main IPC: G01N11/00
- IPC: G01N11/00 ; G01N11/10 ; G01N13/02

Abstract:
Provided are a physical property measurement method, a physical property measurement device, and a probe that can simply measure physical properties of a surface layer portion of an object. A physical property measurement method includes a step of bringing a probe into contact with a surface layer portion of a liquid or gel-like object and maintaining a contact state, a step of measuring a height of the object rising along the probe in contact with the object, and a step of calculating viscous properties or elastic properties of the surface layer portion of the object using the measured height of the object rising along the probe.
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