A method implemented by a multi-chip package (MCP) electronic device including a die-to-die (D2D) interface is provided. The method includes receiving, by a receiver portion of a first die of the D2D interface, and from a transmitter portion of a second die of the D2D interface, a first timing signal and a second timing signal. The method includes generating a timing calibration signal based on a timing value corresponding to a midpoint of an estimated margin between overlaying segments of the first timing signal and a timing value corresponding to a delay of a unit delay associated with the receiver portion. The method includes generating an output timing signal based on the timing calibration signal, and selecting a timing delay signal based on the output timing signal and the timing calibration signal. The timing delay signal is selected to reduce a potential glitch power associated with the receiver portion.