An apparatus comprises a power module housing. The power module housing includes a conductive substrate and a circuit board positioned overlying the conductive substrate. A gate driver is mounted to the circuit board. A power device is mounted to the conductive substrate and is controlled by the gate driver. The power module housing includes an insulation material electrically insulating the conductive substrate from the circuit board. A monitoring component is mounted to at least the conductive substrate and is operatively coupled to the gate driver and the power device.