Invention Grant
- Patent Title: Semiconductor device package and method of fabricating the same
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Application No.: US17227850Application Date: 2021-04-12
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Publication No.: US12288738B2Publication Date: 2025-04-29
- Inventor: Younghwan Park , Jongseob Kim , Jaejoon Oh , Soogine Chong , Sunkyu Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR10-2020-0150994 20201112
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/367 ; H01L29/20
Abstract:
Provided are a semiconductor device package and/or a method of fabricating the semiconductor device package. The semiconductor device package may include a semiconductor device including a plurality of electrode pads on an upper surface of the semiconductor device, a lead frame including a plurality of conductive members bonded to the plurality of electrode pads, and a mold between the plurality of conductive members.
Public/Granted literature
- US20220148948A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-05-12
Information query
IPC分类:
