Invention Grant
- Patent Title: Method and apparatus for assembling a floor panel
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Application No.: US17564591Application Date: 2021-12-29
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Publication No.: US12291879B2Publication Date: 2025-05-06
- Inventor: Jorgen J Moller, Jr. , Jeremiah D. Shapiro
- Applicant: SNAP LOCK INDUSTRIES, INC.
- Applicant Address: US UT Salt Lake City
- Assignee: SNAP LOCK INDUSTRIES, INC.
- Current Assignee: SNAP LOCK INDUSTRIES, INC.
- Current Assignee Address: US UT Salt Lake City
- Agency: DORSEY & WHITNEY LLP
- Main IPC: E04F21/22
- IPC: E04F21/22 ; E04F15/02 ; E04F15/10

Abstract:
An assembly apparatus for assembling a floor panel can include a platform to support a base layer and a top layer of the floor panel. The platform can include a first wall configured to contact a first edge of the base layer and a first edge of the top layer. The platform can further include second wall adjacent to the first wall and configured to contact a second edge of the base layer and a second edge of the top layer. A sensor unit can determine whether the first edge of the base layer is aligned with the first edge of the top layer, and whether the second edge of the base layer is aligned with the second edge of the top layer.
Public/Granted literature
- US20230203824A1 METHOD AND APPARATUS FOR ASSEMBLING A FLOOR PANEL Public/Granted day:2023-06-29
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