Invention Grant
- Patent Title: Key assembly and keyboard
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Application No.: US18249329Application Date: 2022-08-19
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Publication No.: US12293884B2Publication Date: 2025-05-06
- Inventor: Huijie Xu , Haitao Li , Pingping Lei
- Applicant: Honor Device Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Honor Device Co., Ltd.
- Current Assignee: Honor Device Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Priority: CN202111599799.7 20211224
- International Application: PCT/CN2022/113753 WO 20220819
- International Announcement: WO2023/116002 WO 20230629
- Main IPC: H01H13/85
- IPC: H01H13/85 ; H01H13/7065 ; H01H13/83

Abstract:
A key assembly, which includes a support plate, a flexible circuit board, a buffer block, and a pressing assembly. The support plate has a first surface and a second surface that are opposite to each other. The support plate has an accommodating portion that is recessed from the first surface to a side of the second surface, and the accommodating portion limits an accommodating groove. The flexible circuit board is superposed on the first surface, and the flexible circuit board has a through hole that is correspondingly connected to the accommodating groove. The buffer block is disposed in the accommodating groove, and passes through the through hole. The buffer block has a buffer support surface that protrudes from the flexible circuit board away from one side surface of the support plate. The pressing assembly includes a keycap, a support mechanism, and a connecting rod.
Public/Granted literature
- US20240371583A1 Key Assembly and Keyboard Public/Granted day:2024-11-07
Information query
IPC分类: