Invention Grant
- Patent Title: Semiconductor package including shielding cover that covers molded body
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Application No.: US18429039Application Date: 2024-01-31
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Publication No.: US12293977B2Publication Date: 2025-05-06
- Inventor: Young-Woo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Fish & Richardson P.C.
- Priority: KR10-2018-0073589 20180626
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/053 ; H01L23/31 ; H01L23/498 ; H01L25/00 ; H01L25/065 ; H01L25/10
Abstract:
A method of fabricating a semiconductor package includes mounting at least one semiconductor chip to a package substrate, forming a shielding wall around the at least one semiconductor chip, forming a molded body on the package substrate in a space surrounded by the shielding wall, and forming a shielding cover covering the molding unit and in contact with the shielding wall.
Public/Granted literature
- US20240213177A1 FABRICATION METHOD OF SEMICONDUCTOR PACKAGE Public/Granted day:2024-06-27
Information query
IPC分类:
