An IC, comprising a first rail supply, a second rail supply, an external pad coupled to one of the first rail supply and the second rail supply, and an ESD protection circuit coupled to the external pad. The ESD protection circuit includes a slew rate detector coupled to the external pad, an amplifier coupled to an output of the slew rate detector, a one-shot coupled to an output of the amplifier, and a clamp circuit coupled an output of the one-shot.