Invention Grant
- Patent Title: Electronic device including hinge cover
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Application No.: US17733066Application Date: 2022-04-29
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Publication No.: US12294666B2Publication Date: 2025-05-06
- Inventor: Junyong Song , Byoungjin Kim , Sejung Whang , Nakyoung Lee , Valentin Sollier , Yves Behar , Qin Li
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , FUSEPROJECT
- Applicant Address: KR Suwon-si; US CA San Francisco
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,FUSEPROJECT
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,FUSEPROJECT
- Current Assignee Address: KR Suwon-si; US CA San Francisco
- Agency: Nixon & Vanderhye P.C.
- Priority: KR10-2021-0056837 20210430
- Main IPC: H04M1/02
- IPC: H04M1/02

Abstract:
According to various embodiments of the disclosure, an electronic device may include: a first housing, a second housing rotatably coupled with the first housing and configured to rotate between a first position at which the second housing at least partially faces the first housing and a second position at which the second housing is unfolded at a specified angle from the first position, a hinge module including a hinge providing at least one folding axis and rotatably coupling the first housing and the second housing about the folding axis, and a hinge cover disposed between the first housing and the second housing and coupled to surround at least a part of the hinge module, and at least one part of the hinge cover may be configured to be located closer to the hinge module at the second position than at the first position.
Public/Granted literature
- US20220353354A1 ELECTRONIC DEVICE INCLUDING HINGE COVER Public/Granted day:2022-11-03
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