Invention Application
- Patent Title: Nanolaminated thin film circuitry materials
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Application No.: US09781462Application Date: 2001-02-12
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Publication No.: US20010012600A1Publication Date: 2001-08-09
- Inventor: Andrew T. Hunt , Wen-Yi Lin , Richard W. Carpenter
- Applicant: Shipley Company, L.L.C.
- Applicant Address: US MA Marlborough
- Assignee: Shipley Company, L.L.C.
- Current Assignee: Shipley Company, L.L.C.
- Current Assignee Address: US MA Marlborough
- Main IPC: B32B003/00
- IPC: B32B003/00 ; B32B015/00 ; G03F007/00

Abstract:
Nanolaminates are formed by alternating deposition, e.g., by combustion chemical vapor deposition (CCVD), layers of resistive material and layers of dielectric material. Outer resistive material layers are patterned to form discrete patches of resistive material. Electrical pathways between opposed patches of resistive material on opposite sides of the laminate act as capacitors. Electrical pathways horizontally through resistive material layers, which may be connected by via plated holes, act as resistors.
Public/Granted literature
- US06632591B2 Nanolaminated thin film circuitry materials Public/Granted day:2003-10-14
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