Invention Application
- Patent Title: Thermoplastic resin integrated structure
- Patent Title (中): 热塑性树脂一体化结构
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Application No.: US09773627Application Date: 2001-02-02
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Publication No.: US20010034407A1Publication Date: 2001-10-25
- Inventor: Hideyuki Ariyasu , Hironori Tsuji
- Priority: JP2000-025401 20000202; JP2000-120550 20000421; JP2000-255571 20000825
- Main IPC: B32B001/02
- IPC: B32B001/02

Abstract:
A thermoplastic resin integrated structure, which comprises a structural member (A) molded from a resin composition (a) comprising 5-80 wt. % of polyacetal resin (a-1) and 20-95 wt. % of at least one resin (a-2) selected from the group consisting of polyolefin resin, olefinic elastomer and hydrogenated butadienic elastomer, and a structural member (B) molded from thermoplastic resin (b), the integrated structure having at least one structure of the structural member (A) and the structural member (B) as integrated together side by side has a good bonding strength between the structural member (A) molded from polyacetal-based resin and the structural member (B) molded from other thermoplastic resin, typically polyethylene.
Public/Granted literature
- US06977117B2 Thermoplastic resin integrated structure Public/Granted day:2005-12-20
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