Invention Application
- Patent Title: Integrated circuit tester with high bandwidth probe assembly
- Patent Title (中): 具有高带宽探头组合的集成电路测试仪
-
Application No.: US09805668Application Date: 2001-03-13
-
Publication No.: US20010035800A1Publication Date: 2001-11-01
- Inventor: Charles A. Miller
- Applicant: FORMFACTOR, INC.
- Applicant Address: null
- Assignee: FORMFACTOR, INC.
- Current Assignee: FORMFACTOR, INC.
- Current Assignee Address: null
- Main IPC: H03H007/38
- IPC: H03H007/38
Abstract:
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Public/Granted literature
- US06501343B2 Integrated circuit tester with high bandwidth probe assembly Public/Granted day:2002-12-31
Information query
