An electronic part module which is configured to electrically connect an electronic component to a motherboard via a socket, including a conversion board and a sub board. The conversion board is configured to convert a signal from the electronic component and has a plurality of pins projected from the conversion board. The plurality of pins are configured to contact the socket. The sub board is provided between the conversion board and the socket and has a plurality of holes each having a diameter same as or larger than that of each of the plurality of pins which pass through the plurality of holes, respectively.