Invention Application
- Patent Title: Stripping process with fully distributed openings on baffles
- Patent Title (中): 剥离过程在挡板上具有完全分布的开口
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Application No.: US09746751Application Date: 2000-12-21
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Publication No.: US20020008052A1Publication Date: 2002-01-24
- Inventor: Brian W. Hedrick
- Main IPC: C10G011/00
- IPC: C10G011/00 ; B01J008/18 ; B01J020/00

Abstract:
A baffle-style stripper for an FCC process having a complete or nearly complete coverage of stripping openings over the sloped surface of the baffle will provide improved stripping efficiency and catalyst flux through the stripper. The complete distribution of relatively small openings over the entire surface of a sloped baffle has been found to interrupt relatively dense streamers of catalyst that were previously not known to exist and which short-circuited the contact of the stripping fluid with the catalyst. Spreading out the stripping gas across the sloped area of the baffle to a much greater extent than has been practiced in the past has now been found to promote active contacting of the catalyst with the stripping fluid over the entire volume of the stripper between the baffles. As an added benefit, more complete coverage by the stripper openings also prevents choking of stripper flow by the restriction of stripping gas flow to narrow open areas between the sloped baffles. By this discovery, previous limits for typical baffle-type stripper throughput may be increased by as much as 50%.
Public/Granted literature
- US06740227B2 Stripping process with fully distributed openings on baffles Public/Granted day:2004-05-25
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