Invention Application
- Patent Title: Nanocrystalline silicon quantum dots within an oxide layer
- Patent Title (中): 氧化物层内的纳米晶硅量子点
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Application No.: US09811159Application Date: 2001-03-15
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Publication No.: US20020017657A1Publication Date: 2002-02-14
- Inventor: Salvatore Coffa , Davide Patti
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Priority: EP00830197 20000315
- Main IPC: H01L031/072
- IPC: H01L031/072

Abstract:
A process for forming a thin layer of Silicon nanocrystals in an oxide layer is disclosed. The process includes, on a semiconductive substrate, thermally oxidizing a first portion of the substrate into an oxide layer, forming Silicon ions within the layer of oxide, and thermally treating the Silicon ions to become the thin layer of Silicon nanocrystals. In the inventive process the formation of the Silicon ions is by ionic implantation of the Silicon ions into the oxide at an ionization energy of between 0.1 keV and 7 keV, and preferably between 1 and 5 keV. This allows the Silicon atoms to coalesce in a lower temperature than would otherwise be possible. Additionally, more than one layer of nanocrystals can be formed by performing more than one implantation at more than one energy level. Embodiments of the invention can be used to form non-volatile memory devices with a very high quality having a very small size.
Public/Granted literature
- US06774061B2 Nanocrystalline silicon quantum dots within an oxide layer Public/Granted day:2004-08-10
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