Invention Application
US20020023773A1 Method for manufacturing raised electrical contact patten of controlled geometry
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用于制造可控几何形状的凸起的电接触片的方法
- Patent Title: Method for manufacturing raised electrical contact patten of controlled geometry
- Patent Title (中): 用于制造可控几何形状的凸起的电接触片的方法
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Application No.: US09848854Application Date: 2001-05-04
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Publication No.: US20020023773A1Publication Date: 2002-02-28
- Inventor: Igor Yan Khandros
- Applicant: FormFactor, Inc.
- Applicant Address: null
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: null
- Main IPC: H05K001/09
- IPC: H05K001/09
Abstract:
An interposer includes a substrate having opposing surfaces. Conductive terminals are disposed on both surfaces, and conductive terminals on one surface are electrically connected to conductive terminals on the opposing surface. Elongate, springable, conducive interconnect elements are fixed to conductive terminals on both surfaces.
Public/Granted literature
- US06538214B2 Method for manufacturing raised electrical contact pattern of controlled geometry Public/Granted day:2003-03-25
Information query
