In case of manufacturing a disk having a two-layer structure, a glass substrate 13 is bonded to a cover layer 11 through an adhesive layer 12, and a mount hole 14a is formed in a center thereof to form a bonded substrate 14 having a three-layer structure (a). In a state where a stamper 15 formed a predetermined pit pattern is set to a center boss 16, the bonded substrate 14 is pressed downward in a vertical direction while the mount hole 14a of the bonded substrate 14 is aligned with the center boss 16(b). Whereby an information recording surface 11a is transferred onto the cover layer 11(c). Subsequently, after the bonded substrate 14 has been bonded to another layer substrate of the disk, the adhesive layer 12 is removed to separate the glass substrate 13. Finally, there is manufactured the disk having the two-layer structure.