An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.