Invention Application
- Patent Title: MULTI-LAYERED PLAIN BEARING AND PRODUCING METHOD THEREOF
- Patent Title (中): 多层平面轴承及其生产方法
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Application No.: US09977542Application Date: 2001-10-16
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Publication No.: US20020068189A1Publication Date: 2002-06-06
- Inventor: Yukihiko Kagohara , Masahito Fujita , Koichi Yamamoto , Takayuki Shibayama
- Applicant: DAIDO METAL COMPANY LTD.
- Applicant Address: null
- Assignee: DAIDO METAL COMPANY LTD.
- Current Assignee: DAIDO METAL COMPANY LTD.
- Current Assignee Address: null
- Priority: JP2000-317841 20001018
- Main IPC: B32B015/20
- IPC: B32B015/20 ; F16C033/12 ; C22C021/10 ; C22F001/043

Abstract:
Disclosed is a multi-layered plain bearing which comprises a steel back, an intermediate layer made of an aluminum alloy and an aluminum-base bearing alloy layer comprising one or more elements selected from the group consisting of Cu, Zn, Mg and Si. The aluminum-base bearing alloy layer is bonded to the steel back via the intermediate layer and subsequently subjected to a solid solution treatment at a temperature of not lower than 400null C. The adjacent region of the intermediate layer to the steel back consists of, by mass, 2% to 8% of Si, and the balance of Al and incidental impurities.
Public/Granted literature
- US06413654B1 Multi-layered plain bearing and producing method thereof Public/Granted day:2002-07-02
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