Invention Application
- Patent Title: Speaker
- Patent Title (中): 扬声器
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Application No.: US10011770Application Date: 2001-12-11
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Publication No.: US20020076070A1Publication Date: 2002-06-20
- Inventor: Takamasa Yoshikawa , Kiyohide Ogasawara , Hideo Satoh , Atsushi Yoshizawa , Shingo Iwasaki , Nobuyasu Negishi , Takashi Yamada , Takashi Chuman , Kazuto Sakemura , Takuya Hata
- Applicant: PIONEER CORPORATION
- Applicant Address: null
- Assignee: PIONEER CORPORATION
- Current Assignee: PIONEER CORPORATION
- Current Assignee Address: null
- Priority: JPP.2000-381409 20001215
- Main IPC: H04R025/00
- IPC: H04R025/00
Abstract:
A speaker includes a silicone wafer 1, a thermal barrier layer 2 formed by anodizing a part of the silicone wafer 1, and an exothermic electrode 3 made of aluminum formed on the thermal barrier layer 2.
Information query
