Invention Application
- Patent Title: MODULAR STRUCTURAL SURFACE ASSEMBLY
- Patent Title (中): 模块化结构表面装配
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Application No.: US09748988Application Date: 2000-12-27
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Publication No.: US20020078652A1Publication Date: 2002-06-27
- Inventor: E. Gerry Hawkes
- Main IPC: E04F017/04
- IPC: E04F017/04 ; E04B001/18 ; E04C002/38 ; E04F017/08

Abstract:
A modular surface assembly includes a plurality of panels, each panel having a planar top surface, a double-wall skirt extending around the perimeter of the planar surface and defining a narrow gap between the two walls of the skirt. Collinear first holes extend through the skirt at a first location along the skirt and collinear second holes extend through the skirt at a second location along the skirt spaced from the first location. A first connector extends through the first holes and into the gap of one panel for connecting the one panel to an adjacent similar panel at the first location, and a second connector extends through the second holes and into the gap of the one panel for connecting that panel to the adjacent panel at the second location. Various connector designs are also disclosed.
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