- 专利标题: Method of manufacturing SOI element having body contact
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申请号: US10107657申请日: 2002-03-25
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公开(公告)号: US20020098643A1公开(公告)日: 2002-07-25
- 发明人: Shigeru Kawanaka , Takashi Yamada
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Kawasaki-shi
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP9-046688 19970228
- 主分类号: H01L021/8242
- IPC分类号: H01L021/8242
摘要:
A semiconductor device comprises a semiconductor substrate having a first insulator, and a semiconductor channel region formed on the first insulator, wherein the semiconductor channel region comprising at least two first regions both having the first conductivity type, a second region of the conductivity type opposite to the first conductivity type, the second region being provided between the two first regions, a second insulator formed on the second region, a gate electrode formed on the second insulator, a third region having the same conductivity type as that of the second region, the third region being electrically conductive to the second region, a third insulator formed on the third region, the third insulator having a width narrower than the widths of an isolation region for isolating the semiconductor formation region, and a fourth region of the same conductivity type as that of the third region, the fourth region being electrically conductive to the third region.
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