Invention Application
US20020110757A1 Low cost integrated out-of-plane micro-device structures and method of making
有权
低成本的集成外部平面微器件结构和制造方法
- Patent Title: Low cost integrated out-of-plane micro-device structures and method of making
- Patent Title (中): 低成本的集成外部平面微器件结构和制造方法
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Application No.: US09780163Application Date: 2001-02-09
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Publication No.: US20020110757A1Publication Date: 2002-08-15
- Inventor: David K. Fork , Ping Mei , Koenraad F. Van Schuylenbergh
- Applicant: Xerox Corporation
- Applicant Address: null
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: null
- Main IPC: H01F005/00
- IPC: H01F005/00 ; G03F007/00 ; H01F027/28 ; H01G002/00
Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.
Public/Granted literature
- US06595787B2 Low cost integrated out-of-plane micro-device structures and method of making Public/Granted day:2003-07-22
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