Invention Application
US20020110761A1 Low cost integrated out-of-plane micro-device structures and method of making
有权
低成本的集成外部平面微器件结构和制造方法
- Patent Title: Low cost integrated out-of-plane micro-device structures and method of making
- Patent Title (中): 低成本的集成外部平面微器件结构和制造方法
-
Application No.: US09780185Application Date: 2001-02-09
-
Publication No.: US20020110761A1Publication Date: 2002-08-15
- Inventor: David K. Fork , Christopher L. Chua , Koenraad F. Van Schuylenbergh , Noble M. Johnson , David K. Biegelsen
- Applicant: Xerox Corporation
- Applicant Address: null
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: null
- Main IPC: H01F005/00
- IPC: H01F005/00 ; G03F007/00 ; H01F027/28
Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. The high yield structures may be used in numerous electronic applications such as filter circuits.
Public/Granted literature
- US06655964B2 Low cost integrated out-of-plane micro-device structures and method of making Public/Granted day:2003-12-02
Information query
