Invention Application
US20020121292A1 Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
失效
用于减少超声波接合面上粘结剂积聚的方法和装置
- Patent Title: Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
- Patent Title (中): 用于减少超声波接合面上粘结剂积聚的方法和装置
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Application No.: US10029327Application Date: 2001-12-19
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Publication No.: US20020121292A1Publication Date: 2002-09-05
- Inventor: Chinmay Suresh Betrabet , Davis Hoang Nhan , Barton Andrew Laughlin , Daniel Hoo , James Melvin Gaestel
- Applicant: Kimberly-Clark Worldwide, Inc.
- Applicant Address: null
- Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee: Kimberly-Clark Worldwide, Inc.
- Current Assignee Address: null
- Main IPC: B23K001/06
- IPC: B23K001/06 ; B23K005/20
Abstract:
A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such that the fluid is applied is intermittently or continuously applied to at least a portion of the ultrasonic bonding surface.
Public/Granted literature
- US06662992B2 Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces Public/Granted day:2003-12-16
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