Invention Application
- Patent Title: Method of chemical mechanical polishing with controllable pressure and loading area
- Patent Title (中): 化学机械抛光方法，可控压力和加载面积
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Application No.: US10121143Application Date: 2002-04-10
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Publication No.: US20020151251A1Publication Date: 2002-10-17
- Inventor: Steven M. Zuniga
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B051/00
Abstract:
A method of chemical mechanical polishing uses a carrier head having a flexible membrane that applies a load to a substrate in a loading area with a controllable size. One pressurizable chamber in the carrier head controls the size of the loading area, and another chamber controls the pressure applied to the substrate in the loading area.
Public/Granted literature
- US06645044B2 Method of chemical mechanical polishing with controllable pressure and loading area Public/Granted day:2003-11-11
Information query
