Invention Application
- Patent Title: Leadframe-based module DC bus design to reduce module inductance
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Application No.: US10109555Application Date: 2002-03-27
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Publication No.: US20020167828A1Publication Date: 2002-11-14
- Inventor: Scott Parkhill , Sayeed Ahmed , Fred Flett
- Applicant: Ballard Power Systems Corporation
- Applicant Address: US MI Dearborn
- Assignee: Ballard Power Systems Corporation
- Current Assignee: Ballard Power Systems Corporation
- Current Assignee Address: US MI Dearborn
- Main IPC: H05K007/00
- IPC: H05K007/00

Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Public/Granted literature
- US07012810B2 Leadframe-based module DC bus design to reduce module inductance Public/Granted day:2006-03-14
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