Invention Application
- Patent Title: Bending method and bending device
- Patent Title (中): 弯曲方法和弯曲装置
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Application No.: US10169747Application Date: 2002-07-17
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Publication No.: US20030000269A1Publication Date: 2003-01-02
- Inventor: Junichi Koyama , Kazunari Imai , Hitoshi Omata , Osamu Hayama , Hidekatsu Ikeda
- Priority: JP2000-8301 20000117; JP2000-8298 20000117
- Main IPC: B21C051/00
- IPC: B21C051/00

Abstract:
In bending a workpiece (W), a position of the workpiece W relatively pressed down by a punch (P) is directly detected by a plurality of position detection means (RDC1, RDC2 and RDC3) provided in a V-groove (11) of a die, and a bending speed calculation section obtains a bending speed from a change in this position. If bending speeds at position of the respective position detection means differ, a uniform speed arithmetic operation section calculates a bending speed to make the bending speeds at the positions of all of the position detection means uniform, and a driving shaft instruction section controls driving shafts (7L, 7R) to bend the workpiece at the uniform bending speed.
Public/Granted literature
- US07007530B2 Bending method and bending device Public/Granted day:2006-03-07
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