Invention Application
- Patent Title: Bending method and device therefor
- Patent Title (中): 弯曲方法及其装置
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Application No.: US10169744Application Date: 2002-07-17
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Publication No.: US20030010078A1Publication Date: 2003-01-16
- Inventor: Junichi Koyama , Osamu Hayama , Hitoshi Omata , Kazunari Imai
- Priority: JPP2000-8287 20000117
- Main IPC: B21C051/00
- IPC: B21C051/00

Abstract:
At a time of executing a bending process of a work according to a cooperation between a punch and a die, a provisional stroke value for obtaining a predetermined angle is determined on the basis of a bending process condition. A test bending process is executed on the basis of the provisional stroke value, and a striking number required for striking the work until the predetermined angle is obtained is judged. Since a stroke value correction amount at a time of a main bending corresponding to the striking number and the predetermined angle is previously determined, a main bending process is executed by correcting to a stroke value at a time of the main bending by computing the corresponding stroke value correction amount on the basis of the stroke value correction amount at a time of the main bending process.
Public/Granted literature
- US06941784B2 Bending method and device therefor Public/Granted day:2005-09-13
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