A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around this platform. Electrical connection wires connect the chip to the front face of the leads, and encapsulation means encapsulates the chip such that the rear face of the leadframe is visible. The electrical connection leads include an inner end part and an outer end part, the rear faces of the inner and outer end parts lie in the plane of the rear face of the leadframe, and the inner and outer end parts are connected by a branch whose rear face is set back with respect to the plane of the rear face of the leadframe so as to define a rear recess. The electrical connection wires are connected to the leads on the front face of their inner end part.