Invention Application
- Patent Title: Chemical mechanical polishing apparatus with rotating belt
- Patent Title (中): 化学机械抛光装置带旋转带
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Application No.: US10174476Application Date: 2002-06-17
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Publication No.: US20030060143A1Publication Date: 2003-03-27
- Inventor: Manoocher Birang , Lawrence M. Rosenberg , Sasson Somekh , John M. White , Sandra M. Rosenberg
- Applicant: Applied Materials, Inc.
- Applicant Address: null
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: null
- Main IPC: B24B001/00
- IPC: B24B001/00
Abstract:
A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.
Public/Granted literature
- US06729944B2 Chemical mechanical polishing apparatus with rotating belt Public/Granted day:2004-05-04
Information query
