A method of removing the damaged surface layer beneath a coating on a component. The method includes evaluating the component to assess the depth of the damaged substrate layer, followed by sensing a plurality of points over the outer surface of the component to determine a three-dimensional outer surface profile thereof. A three-dimensional grinding profile beneath the outer surface profile is then established based on the depth of the damaged substrate layer beneath the outer surface profile. The component is then ground along the grinding profile such that the damaged substrate layer is substantially removed without significantly removing an undamaged region of the substrate beneath the damaged substrate layer.