Invention Application
- Patent Title: Electrical circuit board and a method for making the same
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Application No.: US10300049Application Date: 2002-11-20
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Publication No.: US20030102152A1Publication Date: 2003-06-05
- Inventor: Lawrence Leroy Kneisel , Mohan Paruchuri , Vivek Jairazbhoy , Vladimir Stoica
- Main IPC: H05K001/02
- IPC: H05K001/02
Abstract:
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.
Public/Granted literature
- US06838623B2 Electrical circuit board and a method for making the same Public/Granted day:2005-01-04
Information query
