Invention Application
US20030186624A1 Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
有权
确定电子器件基板的平坦度的方法，制造基板的方法，掩模坯料的制造方法，转印掩模的制造方法，抛光方法，电子器件基板，掩模板，转印掩模和抛光装置
- Patent Title: Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
- Patent Title (中): 确定电子器件基板的平坦度的方法，制造基板的方法，掩模坯料的制造方法，转印掩模的制造方法，抛光方法，电子器件基板，掩模板，转印掩模和抛光装置
-
Application No.: US10401770Application Date: 2003-03-31
-
Publication No.: US20030186624A1Publication Date: 2003-10-02
- Inventor: Kesahiro Koike , Masato Ohtsuka , Yasutaka Tochihara
- Applicant: HOYA CORPORATION
- Applicant Address: null
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: null
- Priority: JP93479/2002 20020329; JP93491/2002 20020329
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B001/00
Abstract:
A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 nullm and not greater than 0.25 nullm. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.
Public/Granted literature
Information query
