Invention Application
US20030207645A1 Use of printing and other technology for micro-component placement 有权
使用印刷等技术进行微型元件放置

  • Patent Title: Use of printing and other technology for micro-component placement
  • Patent Title (中): 使用印刷等技术进行微型元件放置
  • Application No.: US10214769
    Application Date: 2002-08-09
  • Publication No.: US20030207645A1
    Publication Date: 2003-11-06
  • Inventor: E. Victor GeorgeAlbert M. GreenN. Convers Wyeth
  • Main IPC: H01J009/24
  • IPC: H01J009/24
Use of printing and other technology for micro-component placement
Abstract:
An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.
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