Invention Application
- Patent Title: Low cost integrated out-of-plane micro-device structures and method of making
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Application No.: US10417544Application Date: 2003-04-16
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Publication No.: US20030211761A1Publication Date: 2003-11-13
- Inventor: David K. Fork , Ping Mei , Koenraad F. Van Schuylenbergh
- Applicant: Xerox Corporation
- Applicant Address: null
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: null
- Main IPC: H05K001/00
- IPC: H05K001/00 ; H01R012/00

Abstract:
Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.
Public/Granted literature
- US06848175B2 Method of forming an out-of-plane structure Public/Granted day:2005-02-01
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