Invention Application
- Patent Title: Method and apparatus for polishing, and lapping jig
- Patent Title (中): 抛光和研磨夹具的方法和设备
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Application No.: US10460560Application Date: 2003-06-12
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Publication No.: US20030216106A1Publication Date: 2003-11-20
- Inventor: Shunsuke Sone , Yoshiaki Yanagida , Teruaki Nishioka , Koji Suto
- Applicant: Fujitsu Limited
- Applicant Address: null
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: null
- Priority: JP2000-030454 20000208
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B051/00 ; B24B001/00 ; B24B007/30

Abstract:
Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.
Public/Granted literature
- US06913509B2 Method and apparatus for polishing, and lapping jig Public/Granted day:2005-07-05
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