A method for depositing a substance on a substrate that involves forming a supercritical fluid solution of at least one supercritical fluid solvent and at least one solute, discharging the supercritical fluid solution through an orifice under conditions sufficient to form solid particles of the solute that are substantially free of the supercritical fluid solvent, and electrostatically depositing the solid solute particles onto the substrate. The solid solute particles may be charged to a first electric potential and then deposited onto the substrate to form a film. The solute particles may have a mean particle size of less than 1 micron.