Invention Application
US20040011657A1 Process for forming multi layered coated film and multi layered coated film 审中-公开
用于形成多层涂膜和多层涂膜的方法

  • Patent Title: Process for forming multi layered coated film and multi layered coated film
  • Patent Title (中): 用于形成多层涂膜和多层涂膜的方法
  • Application No.: US10378924
    Application Date: 2003-03-05
  • Publication No.: US20040011657A1
    Publication Date: 2004-01-22
  • Inventor: Hisaichi MuramotoHitoshi HoriKoji Izumiya
  • Priority: JP2002-059011 20020305
  • Main IPC: B32B015/08
  • IPC: B32B015/08
Process for forming multi layered coated film and multi layered coated film
Abstract:
The present invention provides an improved 2 wet coating system. The present invention relates to a process for forming a multi layered coated film comprising the steps of: forming an uncured electrodeposition coated film on an electrically conductive substrate, applying an intermediate coating on the electrodeposition coated film, and then simultaneously heating and curing the uncured electrodeposition coated film and an uncured intermediate coated film, forming an uncured base coated film on the intermediate coated film, applying a clear top coating on the base coated film, and then simultaneously heating and curing the uncured base coated film and an uncured clear coated film; wherein the electrodeposition coating forms a self-stratifying coated film, and a dynamic glass transition temperature of a resin layer (null) in direct contact with the electrically conductive substrate and that of a resin layer (null) in direct contact with the intermediate coated film are controlled.
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