Invention Application
- Patent Title: Method of making device chips collectively from common material substrate
- Patent Title (中): 从普通材料基板集中制造器件芯片的方法
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Application No.: US10352001Application Date: 2003-01-28
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Publication No.: US20040014300A1Publication Date: 2004-01-22
- Inventor: Norinao Kouma , Yoshihiro Mizuno , Hisao Okuda , Ippei Sawaki , Osamu Tsuboi , Yoshitaka Nakamura
- Applicant: FUJITSU LIMITED , FUJITSU MEDIA DEVICES LIMITED
- Applicant Address: JP Kawasaki JP Nagano
- Assignee: FUJITSU LIMITED,FUJITSU MEDIA DEVICES LIMITED
- Current Assignee: FUJITSU LIMITED,FUJITSU MEDIA DEVICES LIMITED
- Current Assignee Address: JP Kawasaki JP Nagano
- Priority: JP2002-210197 20020718
- Main IPC: H01L021/00
- IPC: H01L021/00
Abstract:
A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.
Public/Granted literature
- US06881649B2 Method of making device chips collectively from common material substrate Public/Granted day:2005-04-19
Information query
