Invention Application
US20040029491A1 Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw
有权
用于动态控制半导体切割锯的方法，系统和计算机程序产品
- Patent Title: Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw
- Patent Title (中): 用于动态控制半导体切割锯的方法，系统和计算机程序产品
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Application No.: US10606980Application Date: 2003-06-27
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Publication No.: US20040029491A1Publication Date: 2004-02-12
- Inventor: Edward J. Hubbell III
- Main IPC: B24B049/00
- IPC: B24B049/00 ; B24B051/00
Abstract:
A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. Thus, irregular shaped wafers may be cut without requiring that an entire predefined cutting pattern be carried out and/or without previously mapping the shape of the wafer or portion of a wafer. A map of the wafer or a portion of a wafer may also be generated based on the detection of the saw blade contacting the wafer during a first cutting pass and may be used during a second cutting pass.
Public/Granted literature
- US06945844B2 Methods for dynamically controlling a semiconductor dicing saw Public/Granted day:2005-09-20
Information query
