Invention Application
- Patent Title: Bending device and bending method
- Patent Title (中): 弯曲装置和弯曲方法
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Application No.: US10433783Application Date: 2003-06-06
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Publication No.: US20040055348A1Publication Date: 2004-03-25
- Inventor: Hideaki Takahashi
- Priority: JP2000372829 20001207
- Main IPC: B21C051/00
- IPC: B21C051/00

Abstract:
A moving speed of one of tables 11 during the bending process in an approaching direction is controlled to be a bending process optimal speed which is determined by maximum machine speed inherent in the table 11, a coefficient of a material of a workpiece W, a coefficient of a thickness of the workpiece W, a coefficient of a product shape, and coefficients of dies P and D.
Public/Granted literature
- US07089774B2 Bending device and bending method Public/Granted day:2006-08-15
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