Invention Application
US20040055348A1 Bending device and bending method 有权
弯曲装置和弯曲方法

  • Patent Title: Bending device and bending method
  • Patent Title (中): 弯曲装置和弯曲方法
  • Application No.: US10433783
    Application Date: 2003-06-06
  • Publication No.: US20040055348A1
    Publication Date: 2004-03-25
  • Inventor: Hideaki Takahashi
  • Priority: JP2000372829 20001207
  • Main IPC: B21C051/00
  • IPC: B21C051/00
Bending device and bending method
Abstract:
A moving speed of one of tables 11 during the bending process in an approaching direction is controlled to be a bending process optimal speed which is determined by maximum machine speed inherent in the table 11, a coefficient of a material of a workpiece W, a coefficient of a thickness of the workpiece W, a coefficient of a product shape, and coefficients of dies P and D.
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