Invention Application
- Patent Title: Deformation measuring method and apparatus using electronic speckle pattern interferometry
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Application No.: US10334784Application Date: 2003-01-02
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Publication No.: US20040057054A1Publication Date: 2004-03-25
- Inventor: Satoru Toyooka , Hirofumi Kadono
- Applicant: President of Saitama University
- Applicant Address: JP Saitama-shi
- Assignee: President of Saitama University
- Current Assignee: President of Saitama University
- Current Assignee Address: JP Saitama-shi
- Priority: JP2002-275775 20020920
- Main IPC: G01B011/02
- IPC: G01B011/02

Abstract:
A deformation measuring method using electronic speckle pattern interferometry comprises the steps of subtracting an average intensity from the intensity in a time domain at each point of a speckle pattern image so as to compute the cosine component of intensity; subjecting the cosine component to Hilbert transform in a temporal domain so as to compute the sine component of intensity; determining the arctangent of the ratio between thus computed sine and cosine components so as to determine an object phase; carrying out an unwrapping operation; and outputting three-dimensional deformation distribution data in a displayable mode.
Public/Granted literature
- US06943870B2 Deformation measuring method and apparatus using electronic speckle pattern interferometry Public/Granted day:2005-09-13
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