A semiconductor electronic device is disclosed, which includes a die of a semiconductor material and a holder connected electrically together by wire leads of copper, the semiconductor material die being formed with a plurality of contact pads; the device being characterized by having a welding stud bump of a metal material selected from a group comprising gold, palladium, and alloys thereof, formed on each contact pad in said plurality, each copper wire lead being welded with one end on a stud bump and with the other end to said holder. This electronic device is highly reliable and can be fabricated simply at a low cost.