发明申请
- 专利标题： Method for modulating shapes of substrates
- 专利标题（中）： 调制基板形状的方法
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申请号： US10316963申请日： 2002-12-11
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公开(公告)号： US20040112861A1公开(公告)日： 2004-06-17
- 发明人: Byung J. Choi , Ronald D. Voisin , Sidlgata V. Sreenivasan , Michael P.C. Watts , C. Grant Willson , Norman E. Schumaker
- 申请人： MOLECULAR IMPRINTS, INC.
- 申请人地址： TX Austin
- 专利权人： MOLECULAR IMPRINTS, INC.
- 当前专利权人： MOLECULAR IMPRINTS, INC.
- 当前专利权人地址： TX Austin
- 主分类号： C23F001/00
- IPC分类号： C23F001/00
摘要：
The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.
公开/授权文献
- US06980282B2 Method for modulating shapes of substrates 公开/授权日：2005-12-27
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