发明申请
- 专利标题: Vertical MOSFET SRAM cell
- 专利标题(中): 垂直MOSFET SRAM单元
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申请号: US10318495申请日: 2002-12-11
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公开(公告)号: US20040113207A1公开(公告)日: 2004-06-17
- 发明人: Louis L. Hsu , Oleg Gluschenkov , Jack A. Mandelman , Carl J. Radens
- 申请人: International Business Machines Corporation
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H01L021/00
- IPC分类号: H01L021/00 ; H01L021/8244 ; H01L029/76 ; H01L031/062 ; H01L031/119
摘要:
A method of forming an SRAM cell device includes the following steps. Form pass gate FET transistors and form a pair of vertical pull-down FET transistors with a first common body and a first common source in a silicon layer patterned into parallel islands formed on a planar insulator. Etch down through upper diffusions between cross-coupled inverter FET transistors to form pull-down isolation spaces bisecting the upper strata of pull-up and pull-down drain regions of the pair of vertical pull-down FET transistors, with the isolation spaces reaching down to the common body strata. Form a pair of vertical pull-up FET transistors with a second common body and a second common drain. Then, connect the FET transistors to form an SRAM cell.
公开/授权文献
- US07138685B2 Vertical MOSFET SRAM cell 公开/授权日:2006-11-21
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