An electrical connection device between two conducting tracks of an integrated circuit comprises a first conducting connection between the two tracks. The device further comprises an additional interface of one of the two tracks, different from the interface of the track with the first connection and different from the lateral interface of the track with an insulating material parallel to the flow direction of the electric current in the track. The additional interface is placed at some distance from the first connection which is substantially less than the width of the track. The additional interface may be obtained by placing at least a second conducting connection between the two tracks, or by placing at least one rib in the track, or by placing notches on at least one of the faces of the track.