发明申请
- 专利标题： Substrate and method of separating components from a substrate
- 专利标题（中）： 从基材分离组分的基板和方法
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申请号： US10478737申请日： 2003-11-24
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公开(公告)号： US20040144824A1公开(公告)日： 2004-07-29
- 发明人: Petrus Cornelis Paulus Bouten , Frederik Hendrik In't Veld , Roger Maria Helmut Godfried Wehrens
- 优先权： EP01202030.1 20010529
- 主分类号： B26F003/00
- IPC分类号： B26F003/00
摘要：
A substrate (1) having a first groove (4) is provided with a protrusion (3) on the first groove (4). This protrusion (4) preferably has a top with an apex angle of 30 to 150 degrees and results in a controlled breaking of the substrate (1) and a minimum of loss due to deviations of the crack initiated at the protrusion (4).
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