Invention Application
- Patent Title: Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer
- Patent Title (中): 通过电化学位移沉积在预成型金属层上的铜互连线的成型技术
-
Application No.: US10725552Application Date: 2003-12-03
-
Publication No.: US20040222558A1Publication Date: 2004-11-11
- Inventor: Don-Gey Liu , Tsong-Jen Yang , Chin-Hao Yang , Hong-Yuan Hsu , Wen Luh Yang , Giin-Shan Chen
- Priority: TW91134994 20021203
- Main IPC: B29C059/00
- IPC: B29C059/00 ; B05D005/12
Abstract:
A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.
Public/Granted literature
Information query
